➀ SK Hynix has commenced production of its 321-layer NAND chip; ➁ The chip features the highest number of layers in the industry; ➂ The product was first introduced at Flash Summit 2023 in August.
Recent #3D NAND news in the semiconductor industry
➀ Patriot Memory launches the Viper PV573 PCIe Gen5 SSD with 14,000 MB/s read speeds; ➁ The SSD features 3D NAND technology and an active cooling solution; ➂ It offers capacities of 2TB and 4TB.
➀ KLEVV introduces the GENUINE G560 PCIe Gen5x4 NVMe M.2 SSD with speeds up to 14,000 MB/s; ➁ The SSD features passive cooling and is designed for gamers and content creators; ➂ KLEVV also announces the CRAS C715 PCIe Gen3 SSD with capacities up to 1TB.
1. Samsung has introduced a 61.44 TB SSD, the BM1743, using 7th generation V-NAND QLC memory. 2. The company plans to offer the drive in U.2 and E3.S form factors for PCIe 4.0 and 5.0 respectively. 3. Samsung envisions future drives reaching up to 120 TB capacity based on the same technology.
Kioxia has unveiled its 10th generation 332-layer 3D NAND flash memory technology, offering up to 33% better performance and enhanced bit density, interface speeds, and power efficiency compared to its 8th generation ICs.
The new technology features a CMOS directly Bonded to Array (CBA) and Toggle DDR6.0 interface, enabling a 4.8 GB/s NAND interface speed.
While the 322-layer design is not yet at the company's goal of a 1,000-layer 3D NAND by 2027, it still represents a significant advancement in bit density by 59% and power efficiency improvements.
➀ Samsung Electronics is releasing a 1Tbit 3D NAND flash memory with storage cell layers up to 400+ layers, achieving a memory density of 28.2Gbit/mm2 using TLC method.
➁ Kioxia and Western Digital's joint development team is reporting a 1Tbit 3D NAND flash memory with 332 layers, with a memory density of up to 29Gbit/mm2.
➂ SK Hynix has developed a 2Tbit 3D NAND flash memory with 321 layers, using QLC method multi-value storage.
➃ Samsung is currently developing the 9th generation 3D NAND with 286 layers and is working on 400-layer technology.
➄ SK Hynix is exploring the potential of manufacturing 3D NAND at ultra-low temperatures, aiming to produce new generation products with over 400 layers by 2025.➅ Kioxia plans to mass-produce 3D NAND storage devices with over 1,000 layers by 2031.
➆ The journey towards 1,000-layer 3D NAND involves multiple improvements in manufacturing processes, including vertical, horizontal, and logical aspects.
➀ Phison introduces its next-generation PCIe 5.0 SSD controller, PS5028-E28; ➁ The controller supports up to 32TB SSDs with a 4200 MT/s interface; ➂ It promises up to 14.5 GB/s sequential read and write performance.
➀ The chip industry is striving to increase the stack height of 3D NAND flash memory from 200 layers to 800 layers or more in the coming years to meet the endless demand for various types of memory.
➁ The additional layers will bring new reliability issues and a series of incremental reliability challenges, but the NAND flash memory industry has been steadily increasing the stack height over the past decade.
➂ The development direction of 3D NAND is from 500 to 1,000 layers. However, achieving so many layers is not just a matter of doing more of what we have been doing.
➀ Samsung is preparing to unveil its 10th generation V-NAND with over 400 layers; ➁ The new 3D NAND will support PCIe 5.0 and potentially PCIe 6.0 SSDs; ➂ The 1Tb 3D TLC NAND has a storage density of 28 Gb/mm², slightly lower than the current world's densest non-volatile memory.
❶ YMTC has filed a lawsuit against Micron in the U.S., accusing Micron of infringing 11 of its patents related to 3D NAND technology. ❷ YMTC is seeking to halt Micron's sales in the U.S. and is asking for royalty fees. ❸ Despite facing challenges due to U.S. sanctions, YMTC continues to innovate and improve its 3D NAND technology.
1. Kioxia has ceased its 3D NAND production cuts that started in October 2022. 2. This decision may lead to stabilization or a decline in 3D NAND prices.